BAE Systems has been awarded a contract by the US Defense Advanced Research Projects Agency (DARPA) to to build the next generation of mixed-signal electronics.
Under the contract, worth $8 million, BAE Systems FAST Labs research and development team will be tasked to design and develop wafer-scale technology on a silicon foundry platform in collaboration with programme foundries.
The technology aims to enable new Department of Defense (DoD) applications, including high capacity, robust communications, radars and precision sensors.
BAE Systems FAST Labs Radio Frequency, Electronic Warfare, and Advanced Electronics product line director Chris Rappa said: “T-MUSIC will incorporate analogue and digital signals on a single chip for high-performance data converters and digital processing and intelligence.
“The advanced electronics we are developing under the T-MUSIC programme could create the foundation for greatly enhanced Department of Defense capabilities in advanced RF sensors and high-capacity communications.”